| PART |
Description |
Maker |
| DFBM-CR220 |
Bluetooth Module Class 2 Wireless communication module compliant with Bluetooth Specification V1.2
|
Delta Electronics, Inc.
|
| STA8058 |
Teseo high performance GPS multi chip module (MCM)
Teseo⑩ high performance GPS multi chip module (MCM)
|
STMicroelectronics
|
| TH50VSF4682AASB TH50VSF4683AASB |
MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
| FDMF6700 |
Driver plus FET Multi-chip Module
|
Fairchild Semiconductor
|
| TH50VPN564 TH50VPN5640EBSB |
MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS PSEUDO SRAM AND NAND E2PROM MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
| WEDPNF8M721V-XBX WEDPNF8M721V-1010BC WEDPNF8M721V- |
8Mx72 Synchronous DRAM 8Mb Flash Mixed Module Multi-Chip Package 8Mx72同步DRAM 8MB闪存的混合模块多芯片封装
|
Electronic Theatre Controls, Inc.
List of Unclassifed Manufacturers
|
| BK3211 |
Single Chip for Bluetooth
|
Beken
|
| BTM256 |
Bluetooth Module
|
BUDDIES TECHNOLOGY LIMI...
|
| BLUEM-D1X0 |
Bluetooth Module
|
List of Unclassifed Manufacturers
List of Unclassifed Manufac...
|
| BM20 |
Bluetooth Module
|
Microchip
|
| RN52-I/RM |
Bluetooth Module
|
Microchip
|
